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Join Us in Shaping the Future of Quantum Computing
Responsibilities
- Explore new materials and manufacturing methods to enhance component quality, accelerate production, and drive continuous process improvement. Improve alignment and welding tools to ensure long-term efficiency in 3D architecture production and assembly.
- Nanofabrication Expertise: Perform nanofabrication processes using techniques such as sputtering, evaporation, and ICP-RIE to contribute to the development of key components that advance our Quantum Processor Unit (QPU) architecture.
- Package Design: Innovate and implement packaging solutions for the next generation of large-scale QPUs.
Job Requirements
- Have a technical background in mechanics, electronics, chemistry, physics, or related fields
- 3+ years of experience in chip manufacturing, assembly, and packaging
- Experience working in a cleanroom environment
- Proficiency in design software such as AutoCAD and/or Solidworks
- Familiarity with cryogenic measurements
- Understanding of superconductivity
- Proficient in Chinese and Englishis a strong plus